Global Copper Clad Laminates Market is valued approximately at USD XX billion in 2022 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2023-2030. Copper Clad Laminates (CCL) are essential materials in the electronics industry, particularly in the production of printed circuit boards (PCBs). A PCB is a crucial component in electronic devices, providing mechanical support and electrical connections between various electronic components. Copper Clad Laminates play a critical role in enabling the miniaturization, complexity, and functionality of electronic devices. The choice of CCL type depends on the specific requirements of the application, such as signal integrity, thermal performance, and reliability. The key factors driving the market growth are increasing demand for electronics, rising adoption of electric vehicles (EVs), and rising application in aerospace and defense that anticipated to support the market growth during forecast period 2023-2030.
Additionally, the automotive industry’s shift towards electric vehicles has increased the demand for CCLs. EVs rely heavily on electronic components, and advanced PCBs are crucial for various systems, including battery management, power electronics, and in-car communication. Thus, the growing demand for the EVs is anticipated to support the market growth. According to the latest report from the Federation of Automobile Dealers Association (FADA) in India, electric passenger vehicle sales have experienced significant growth. As of March 2023, the sales figure stands at 8,566 units, marking a notable increase from the 3,718 units sold in March 2022. Similarly, the German Association of the Automotive Industry reports a robust performance in the German market. In 2022, the sales of passenger electric vehicles reached an impressive 833,500 units, reflecting a remarkable 22% increase compared to the figures from 2021. As a result, the rising adoption of electric passenger vehicles is anticipated to support the market growth. Moreover, the growth in 5G infrastructure, and technological advancements in electronics sector is anticipated to create the lucrative opportunity for the market during forecast period 2023-2030. However, the rising raw material prices stifles market growth throughout the forecast period of 2023-2030.
The key regions considered for the Global Copper Clad Laminates Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 with largest market share owing to the growing electronics industry, rising 5G deployment, miniaturization of electronics, and presence of key market players. Whereas, the Asia Pacific is expected to grow with the highest CAGR during the forecast period, owing to factors such as the growing electronics and telecommunications industry, rapid urbanization and industrialization, and rising consumer electronics consumption.
Major market player included in this report are:
Comet Impreglam LLP.
Sumitomo Bakelite Co., Ltd.
Chang Chun Group.
Shandong Jinbao Electronics Co., LTD.
Taiwan Union Technology Corporation.
Nan Ya Plastics Corporation
Panasonic Corporation
ITEQ Corporation
Shengyi Technology Co., Ltd.
Cipel Italia S.r.l.
Recent Developments in the Market:
Ø In January 2022, Panasonic corporation’s industry company has developed the MEGTRON 8 multi-layer circuit board materials featuring low transmission loss specifically for high-speed networking devices.
Global Copper Clad Laminates Market Report Scope:
ü Historical Data – 2020 – 2021
ü Base Year for Estimation – 2022
ü Forecast period – 2023-2030
ü Report Coverage – Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
ü Segments Covered – Type, Reinforcement Material, Resin Type, Application, Region
ü Regional Scope – North America; Europe; Asia Pacific; Latin America; Middle East & Africa
ü Customization Scope – Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Type:
Rigid copper clad laminates
Flexible copper clad laminates
By Reinforcement Material:
Glass Fiber
Paper Base
Compound Materials
By Resin Type:
Epoxy
Phenolic
Polyimide
Others
By Application:
Computers
Communication Systems
Consumer Appliances
Vehicle Electronics
Healthcare Devices
Defense Technology
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa