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Global Semiconductor Bonding Equipment Market to reach USD X billion by the end of 2030.

Global Semiconductor Bonding Equipment Market Size study & Forecast, by Type (Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment), by Application (Advanced Packaging, Power IC & Power Discrete, Photonic Devices, MEMS Sensors & Actuators, Engineered Substrates, and CMOS Image Sensor (CIS)), and Regional Analysis, 2023-2030

Product Code: EESC-19351050
Publish Date: 10-09-2023
Page: 200

Global Semiconductor Bonding Equipment Market is valued at approximately USD X billion in 2022 and is anticipated to grow with a healthy growth rate of more than 11.76% over the forecast period 2023-2030. Wafer substrate bonding units are used to adhere a thin substrate wafer to a support carrier disc during the wafer bonding process. This is accomplished using a variety of bonding procedures that call for different tools or equipment. Permanent bonding, transient bonding, and hybrid bonding are all forms of equipment. Atoms are bound together to produce a homogenous structure in semiconductor arrangements, which are utilized to create various integrated circuits (ICs) and production equipment. The material’s structure is consistent and almost identical throughout the bonding model. The market growth is driven by key factors such as rising demand for Semiconductor Chips across various applications and increasing investment by Semiconductor manufacturers to expand their manufacturing capacity.

According to Statista, the worldwide semiconductor industry generated slightly under 600 billion dollars in sales in 2022, an increase from the previous year when total revenues totaled 595 billion dollars. The semiconductor market’s revenues are only projected to be 630.9 billion dollars in 2024. Additionally, in December 2022, China announced a subsidy program for its semiconductor sector worth more than CNY 1 trillion (USD 143 billion), which considerably increased chip self-sufficiency and was a response to American efforts to hinder its technological advancement. The majority of the financial aid is expected to be utilized to finance Chinese companies’ acquisitions of domestic semiconductor equipment, which will likely boost regional market demand. Moreover, adoption of IoT and AI in the automotive sector and technological investments in offering next-generation semiconductor bonding solutions create lucrative opportunities during the years. However, high cost of ownership and increased complexity owing to miniaturization of circuits stifle market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global Semiconductor Bonding Equipment Market study include Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. Asia Pacific is leading the global market share and expected to be the fastest growing region owing to growing investments to support the semiconductor industry and strategic investments by key domestic suppliers.

Major market players included in this report are:
Kulicke and Soffa Industries Inc.
EV Group
ASMPT Semiconductor Solutions
MRSI Systems. (Myronic AB)
WestBond Inc.
Panasonic Industry Co. Ltd.
Palomar Technologies
Dr. Tresky AG
BE Semiconductor Industries NV
Fasford Technology Co.Ltd (Fuji Group)

Recent Developments in the Market:
Ø October 2022, a new semiconductor assembly and testing facility is likely to be built in Penang, according to proposals released by BE Semiconductor Industries NV. The new facility, which consists of two buildings (Plants 4 and 5), will be in the Bayan Lepas Free Industrial Zone and have a total built-up area of 982,000 square feet. The project is anticipated to be finished in 2025 and would open over 2,700 job possibilities in the location.
Ø July 2022, the most recent development in the MRSI-H/HVM-series product line, MRSI-H-HPLD+, has been introduced by MRSI Systems (Mycronic Group). In order to dramatically increase productivity utilising parallel processing while preserving excellent precision and flexibility, this new variation of MRSI-H-HPLD is designed for high-power laser die attachment applications.
Global Semiconductor Bonding Equipment Market Report Scope:
ü Historical Data – 2020 – 2021
ü Base Year for Estimation – 2022
ü Forecast period – 2023-2030
ü Report Coverage – Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
ü Segments Covered – Type, Application, Region
ü Regional Scope – North America; Europe; Asia Pacific; Latin America; Middle East & Africa
ü Customization Scope – Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type:
Permanent Bonding Equipment
Temporary Bonding Equipment
Hybrid Bonding Equipment

By Application:
Advanced Packaging
Power IC and Power Discrete
Photonic Devices
MEMS Sensors and Actuators
Engineered Substrates
CMOS Image Sensors (CIS)

By Region:

North America
U.S.
Canada

Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC

Latin America
Brazil
Mexico

Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2020-2030 (USD Billion)
1.2.1. Semiconductor Bonding Equipment Market, by Region, 2020-2030 (USD Billion)
1.2.2. Semiconductor Bonding Equipment Market, by Type, 2020-2030 (USD Billion)
1.2.3. Semiconductor Bonding Equipment Market, by Application, 2020-2030 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Semiconductor Bonding Equipment Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Industry Evolution
2.2.2. Scope of the Study
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Semiconductor Bonding Equipment Market Dynamics
3.1. Semiconductor Bonding Equipment Market Impact Analysis (2020-2030)
3.1.1. Market Drivers
3.1.1.1. Rising Demand for Semiconductor Chips across Various Applications
3.1.1.2. Increasing Investment by Semiconductor Manufacturers to Expand their Manufacturing Capacity
3.1.2. Market Challenges
3.1.2.1. High Cost of Ownership
3.1.2.2. Increased Complexity Owing to Miniaturization of Circuits
3.1.3. Market Opportunities
3.1.3.1. Adoption of IoT and AI in the automotive sector
3.1.3.2. Technological investments in offering next-generation semiconductor bonding solutions
Chapter 4. Global Semiconductor Bonding Equipment Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.2. Porter’s 5 Force Impact Analysis
4.3. PEST Analysis
4.3.1. Political
4.3.2. Economical
4.3.3. Social
4.3.4. Technological
4.3.5. Environmental
4.3.6. Legal
4.4. Top investment opportunity
4.5. Top winning strategies
4.6. COVID-19 Impact Analysis
4.7. Disruptive Trends
4.8. Industry Expert Perspective
4.9. Analyst Recommendation & Conclusion
Chapter 5. Global Semiconductor Bonding Equipment Market, by Type
5.1. Market Snapshot
5.2. Global Semiconductor Bonding Equipment Market by Type, Performance – Potential Analysis
5.3. Global Semiconductor Bonding Equipment Market Estimates & Forecasts by Type 2020-2030 (USD Billion)
5.4. Semiconductor Bonding Equipment Market, Sub Segment Analysis
5.4.1. Permanent Bonding Equipment
5.4.2. Temporary Bonding Equipment
5.4.3. Hybrid Bonding Equipment
Chapter 6. Global Semiconductor Bonding Equipment Market, by Application
6.1. Market Snapshot
6.2. Global Semiconductor Bonding Equipment Market by Application, Performance – Potential Analysis
6.3. Global Semiconductor Bonding Equipment Market Estimates & Forecasts by Application 2020-2030 (USD Billion)
6.4. Semiconductor Bonding Equipment Market, Sub Segment Analysis
6.4.1. Advanced Packaging
6.4.2. Power IC and Power Discrete
6.4.3. Photonic Devices
6.4.4. MEMS Sensors and Actuators
6.4.5. Engineered Substrates
6.4.6. CMOS Image Sensors (CIS)
Chapter 7. Global Semiconductor Bonding Equipment Market, Regional Analysis
7.1. Top Leading Countries
7.2. Top Emerging Countries
7.3. Semiconductor Bonding Equipment Market, Regional Market Snapshot
7.4. North America Semiconductor Bonding Equipment Market
7.4.1. U.S. Semiconductor Bonding Equipment Market
7.4.1.1. Type breakdown estimates & forecasts, 2020-2030
7.4.1.2. Application breakdown estimates & forecasts, 2020-2030
7.4.2. Canada Semiconductor Bonding Equipment Market
7.5. Europe Semiconductor Bonding Equipment Market Snapshot
7.5.1. U.K. Semiconductor Bonding Equipment Market
7.5.2. Germany Semiconductor Bonding Equipment Market
7.5.3. France Semiconductor Bonding Equipment Market
7.5.4. Spain Semiconductor Bonding Equipment Market
7.5.5. Italy Semiconductor Bonding Equipment Market
7.5.6. Rest of Europe Semiconductor Bonding Equipment Market
7.6. Asia-Pacific Semiconductor Bonding Equipment Market Snapshot
7.6.1. China Semiconductor Bonding Equipment Market
7.6.2. India Semiconductor Bonding Equipment Market
7.6.3. Japan Semiconductor Bonding Equipment Market
7.6.4. Australia Semiconductor Bonding Equipment Market
7.6.5. South Korea Semiconductor Bonding Equipment Market
7.6.6. Rest of Asia Pacific Semiconductor Bonding Equipment Market
7.7. Latin America Semiconductor Bonding Equipment Market Snapshot
7.7.1. Brazil Semiconductor Bonding Equipment Market
7.7.2. Mexico Semiconductor Bonding Equipment Market
7.8. Middle East & Africa Semiconductor Bonding Equipment Market
7.8.1. Saudi Arabia Semiconductor Bonding Equipment Market
7.8.2. South Africa Semiconductor Bonding Equipment Market
7.8.3. Rest of Middle East & Africa Semiconductor Bonding Equipment Market

Chapter 8. Competitive Intelligence
8.1. Key Company SWOT Analysis
8.1.1. Company 1
8.1.2. Company 2
8.1.3. Company 3
8.2. Top Market Strategies
8.3. Company Profiles
8.3.1. Kulicke and Soffa Industries Inc.
8.3.1.1. Key Information
8.3.1.2. Overview
8.3.1.3. Financial (Subject to Data Availability)
8.3.1.4. Product Summary
8.3.1.5. Recent Developments
8.3.2. EV Group
8.3.3. ASMPT Semiconductor Solutions
8.3.4. MRSI Systems. (Myronic AB)
8.3.5. WestBond Inc.
8.3.6. Panasonic Industry Co. Ltd.
8.3.7. Palomar Technologies
8.3.8. Dr. Tresky AG
8.3.9. BE Semiconductor Industries NV
8.3.10. Fasford Technology Co.Ltd (Fuji Group)
Chapter 9. Research Process
9.1. Research Process
9.1.1. Data Mining
9.1.2. Analysis
9.1.3. Market Estimation
9.1.4. Validation
9.1.5. Publishing
9.2. Research Attributes
9.3. Research Assumption

At Bizwit Research and Consultancy, we employ a thorough and iterative research methodology with the goal of minimizing discrepancies, ensuring the provision of highly accurate estimates and predictions over the forecast period. Our approach involves a combination of bottom-up and top-down strategies to effectively segment and estimate quantitative aspects of the market, utilizing our proprietary data & AI tools. Our Proprietary Tools allow us for the creation of customized models specific to the research objectives. This enables us to develop tailored statistical models and forecasting algorithms to estimate market trends, future growth, or consumer behavior. The customization enhances the accuracy and relevance of the research findings.
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Critical elements of methodology employed for all our studies include:
Data Collection:
To determine the appropriate methods of data collection based on the research objectives, we consider both primary and secondary sources. Primary data collection involves gathering information directly from various industry experts in core and related fields, original equipment manufacturers (OEMs), vendors, suppliers, technology developers, alliances, and organizations. These sources encompass all segments of the value chain within the specific industry. Through in-depth interviews, we engage with key industry participants, subject-matter experts, C-level executives of major market players, industry consultants, and other relevant experts. This allows us to obtain and validate critical qualitative and quantitative information while evaluating market prospects. AI and Big Data are instrumental in our primary research, providing us with powerful tools to collect, analyze, and derive insights from data efficiently. These technologies contribute to the advancement of research methodologies, enabling us to make data-driven decisions and uncover valuable findings.
In addition to primary sources, we extensively utilize secondary sources to enhance our research. These include directories, databases, journals focusing on related industries, company newsletters, and information portals such as Bloomberg, D&B Hoovers, and Factiva. These secondary sources enable us to identify and gather valuable information for our comprehensive, technical, market-oriented, and commercial study of the market. Additionally, we utilize AI algorithms to automate the collection of vast amounts of data from various sources such as surveys, social media platforms, online transactions, and web scraping. And employ Big Data technologies for storage and processing of large datasets, ensuring that no valuable information is missed during the data collection process.
Data Analysis:
Our team of experts carefully examine the gathered data using suitable statistical techniques and qualitative analysis methods. For quantitative analysis, we employ descriptive statistics, regression analysis, and other advanced statistical methods, depending on the characteristics of the data. This analysis may also incorporate the utilization of AI tools and big data analysis techniques to extract meaningful insights.
To ensure the accuracy and reliability of our findings, we extensively leverage data science techniques, which help us minimize discrepancies and uncertainties in our analysis. We employ Data Science to clean and preprocess the data, ensuring its quality and reliability. This involves handling missing data, removing outliers, standardizing variables, and transforming data into suitable formats for analysis. The application of data science techniques enhances our accuracy, efficiency, and depth of analysis, enabling us to stay competitive in dynamic market environments.
Market Size Estimation:
Our proprietary data tools play a crucial role in deriving our market estimates and forecasts. Each study involves the creation of a unique and customized model. The model incorporates the gathered information on market dynamics, technology landscape, application development, and pricing trends. AI techniques, such as machine learning and deep learning, aid us to analyze patterns within the data to identify correlations, trends, and relationships. By recognizing patterns in consumer behavior, purchasing habits, or market dynamics, our AI algorithms aid us in more precise estimations of market size. These factors are simultaneously analyzed within the model, allowing for a comprehensive assessment. To quantify their impact over the forecast period, correlation, regression, and time series analysis are employed.
To estimate and validate the market size, we employ both top-down and bottom-up approaches. The preference is given to a bottom-up approach, where key regional markets are analyzed as separate entities. This data is then integrated to obtain global estimates. This approach is crucial as it provides a deep understanding of the industry and helps minimize errors.
In our forecasting process, we consider various parameters such as economic tools, technological analysis, industry experience, and domain expertise. By taking all these factors into account, we strive to produce accurate and reliable market forecasts. When forecasting, we take into consideration several parameters, which include:
Market driving trends and favorable economic conditions
Restraints and challenges that are expected to be encountered during the forecast period.
Anticipated opportunities for growth and development
Technological advancements and projected developments in the market
Consumer spending trends and dynamics
Shifts in consumer preferences and behaviors.
The current state of raw materials and trends in supply versus pricing
Regulatory landscape and expected changes or developments.
The existing capacity in the market and any expected additions or expansions up to the end of the forecast period.
To assess the market impact of these parameters, we assign weights to each one and utilize weighted average analysis. This process allows us to quantify their influence on the market and derive an expected growth rate for the forecasted period. By considering these various factors and applying a weighted analysis approach, we strive to provide accurate and reliable market forecasts.
Insight Generation & Report Presentation:
After conducting the research, our experts analyze the findings in relation to the research objectives and the specific needs of the client. They generate valuable insights and recommendations that directly address the client’s business challenges. These insights are carefully connected to the research findings to provide a comprehensive understanding.
Next, we create a well-structured research report that effectively communicates the research findings, insights, and recommendations to the client. To enhance clarity and comprehension, we utilize visual aids such as charts, graphs, and tables. These visual elements are employed to present the data in an engaging and easily understandable format, ensuring that the information is accessible and visually appealing to the client. Our aim is to deliver a clear and concise report that conveys the research findings effectively and provides actionable recommendations to meet the client’s specific needs.

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